Title :
Hybrid modeling method for transient simulation of multilayered power/ground planes
Author :
Watanabe, Toshio
Author_Institution :
Grad. Sch. of Manage. & Inf. of Innovation, Univ. of Shizuoka, Shizuoka, Japan
Abstract :
The power integrity is one of the serious problem in the design of three-dimensional integrated circuits and packaging. Usually, the board and interposer carrying them have multilayered power/ground plane, which plays an important role in the power distribution network (PDN) of the system. Therefore, the modeling and simulation of multilayered power/ground planes become increasingly important.
Keywords :
three-dimensional integrated circuits; 3D integrated circuits; hybrid modeling method; interposer; multilayered power/ground planes; packaging; power distribution network; power integrity; transient simulation; Equivalent circuits; Hidden Markov models; Hybrid power systems; Integrated circuit modeling; Load modeling; Standards; Transient analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457898
