Power LED heat removal measuring method

Author

Dragomir, Radu Bogdan ; Pantelimon, Brandusa

Author_Institution

Dept. of Electr. Eng., Univ. of Polytechnics Bucharest, Bucharest, Romania

fYear

2012

fDate

25-27 Oct. 2012

Firstpage

958

Lastpage

963

Abstract

The present paper approaches a comprehensive model of light emitting diodes (LED) resulting in thermic properties description. A generally presentation of concepts that were taken in consideration, in order to describe the model, are been discussed. Electrical measurements of the junction heat and simulation tools are used to characterize the thermic behavior of power LEDs. A thermal resistor network model was combined with a 3D finite element model of a power LED die in order to estimate both the junction temperature and the assembly case temperature. A passive cooling steady state thermic regime is considered. Die thermal stress and heat flow are related to the conduction heat transfer coefficient.

Keywords

finite element analysis; heat conduction; light emitting diodes; thermal stresses; 3D finite element model; assembly case temperature; comprehensive model; conduction heat transfer coefficient; die thermal stress; electrical measurements; junction heat; junction temperature; light emitting diodes; passive cooling steady state thermic regime; power LED heat removal measuring method; thermal resistor network model; thermic properties; Finite element methods; Heat sinks; Light emitting diodes; Mathematical model; Resistance heating; Temperature measurement; Thermal resistance; LED; SSL; conduction; convection; heat dissipation; thermal management; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Power Engineering (EPE), 2012 International Conference and Exposition on

Conference_Location

Iasi

Print_ISBN

978-1-4673-1173-1

Type

conf

DOI

10.1109/ICEPE.2012.6463576

Filename

6463576