• DocumentCode
    597060
  • Title

    A readout circuit implementation to reduce the flicker noise in MEMS electrothermal sensors

  • Author

    Mohammadi, Arash ; Yuce, Mehmet Rasit ; Moheimani, S.O.R.

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Univ. of Newcastle, Callaghan, NSW, Australia
  • fYear
    2012
  • fDate
    9-12 Dec. 2012
  • Firstpage
    121
  • Lastpage
    124
  • Abstract
    The electrothermal displacement sensors are doped silicon resistors. The electrical current through the doped silicon generates flicker and thermal noise which degrades the sensitivity of these sensors. We propose an alternative readout method in which driving the silicon heaters with a high frequency voltage instead of a dc voltage leads to a lower flicker noise. The output of the sensor, in a simple wheatstone bridge configuration, is amplified by a low noise differential amplifier which attenuates the heating high frequency voltage as a common mode input. The proposed technique has been applied to a MEMS electrothermal sensor fabricated in the standard silicon on insulator (SOI) process. Experimental results demonstrate an 8dB improvement in SNR compared to the conventional measurement technique. The achieved noise floor is less than -100 dBVrms around the 20 Hz measured signal which translates to equation to 0.1nm/√(Hz) displacement noise in a MEMS nanopositioner.
  • Keywords
    displacement measurement; elemental semiconductors; flicker noise; microsensors; readout electronics; resistors; silicon; silicon-on-insulator; thermal noise; MEMS electrothermal sensors; MEMS nanopositioner; SOI; Si; alternative readout method; displacement noise; electrical current; electrothermal displacement sensors; flicker noise; heaters; low noise differential amplifier; readout circuit implementation; resistors; silicon on insulator; thermal noise; wheatstone bridge; Heating; Micromechanical devices; Noise; Resistors; Silicon; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems (ICECS), 2012 19th IEEE International Conference on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4673-1261-5
  • Electronic_ISBN
    978-1-4673-1259-2
  • Type

    conf

  • DOI
    10.1109/ICECS.2012.6463784
  • Filename
    6463784