Title :
On controlling EBL parameters for nanoelectromechanical resonators fabricated on insulating/semiconducting structures
Author :
Dow, A.B.A. ; Lin, Huiming ; Popov, C. ; Schmid, Ulrich ; Kherani, Nazir P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON, Canada
Abstract :
The current work details the development and optimization of the fabrication processes for nanoelectromechanical resonators such as surface and bulk acoustic wave (SAW/BAW) devices that operate in GHz range, specifically based on nano-interdigitated transducers (n-IDTs). The method combines electron-beam lithography (EBL) and lift-off process to fabricate the n-IDTs with finger patterns having line widths of the order of 100 nm on AlN/UNCD(aluminum nitride/ultrananocrystalline diamond) combined structures deposited on crystalline silicon. The widespread availability of this method has led to the study of the combination of processing parameters for both EBL and lift-off for its application in the realization of n-IDTs. The fabricated devices exhibited high frequency range up to 15 GHz with minimum stop-band rejection of 25dB. Excellent filtering response of the devices and the compatibility of fabrication processes with existing manufacturing technologies pave the way towards advanced AlN/UNCD based nano-resonantors.
Keywords :
bulk acoustic wave devices; electron beam lithography; nanoelectromechanical devices; resonators; surface acoustic waves; AlN-UNCD combined structures; BAW device; EBL parameters; SAW device; aluminum nitride; bulk acoustic wave; crystalline silicon; electron-beam lithography; fabrication process; insulating-semiconducting structures; lift-off process; nanoelectromechanical resonators; nanointerdigitated transducers; size 100 nm; surface acoustic wave; ultrananocrystalline diamond; Diamonds; Fabrication; Lithography; Nanoscale devices; Optimization; Surface acoustic wave devices; Surface acoustic waves;
Conference_Titel :
Nanoelectronics Conference (INEC), 2013 IEEE 5th International
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4840-9
Electronic_ISBN :
2159-3523
DOI :
10.1109/INEC.2013.6466035