• DocumentCode
    597654
  • Title

    The side effects on N-Type FinFET Devices

  • Author

    Hsin-Chia Yang ; Chong-Kuan Du ; Wen-Shiang Liao ; Jing-Zong Jhang ; Yi-Hong Lee ; Tsao-Yeh Chen ; Ko-Fan Liao ; Mu-Chun Wang ; SungChing Chi ; Shea-Jue Wang

  • Author_Institution
    Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    2-4 Jan. 2013
  • Firstpage
    483
  • Lastpage
    485
  • Abstract
    Fin-FET is so expected because it protects Ioff current from outrageously leaky as the channel length gets shorten continuously. It thus keeps the threshold voltage and the swing from rolling-up. Those good characteristics are manifested by the fully depleted region and the lack of leaky body as the gate is biased. In this study, the fin-thickness effect is to be noticeably discussed. The correlated swings are to be determined and compared between the two kinds. The P-well Vt adjustment at two different energies, 10KeV and 6KeV, are also put into split.
  • Keywords
    MOSFET; N-type FinFET device; P-well Vt adjustment; correlated swings; electron volt energy 10 keV; electron volt energy 6 keV; fin-thickness effect; threshold voltage; FinFETs; Implants; Leakage current; Logic gates; Reliability; Silicon on insulator technology; Threshold voltage; 3-D Fin Structure; FinFET Devices; Leakage current; Over Etching); Over Exposure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2013 IEEE 5th International
  • Conference_Location
    Singapore
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4673-4840-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2013.6466084
  • Filename
    6466084