• DocumentCode
    597657
  • Title

    Study of surfactant modified MWNT/polyimide composites by in-situ polymerization

  • Author

    Hung-Han Ko ; Yao-Yi Cheng ; Ching-wei Wang

  • Author_Institution
    Inst. of Org. & Polymeric Mater., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • fYear
    2013
  • fDate
    2-4 Jan. 2013
  • Firstpage
    492
  • Lastpage
    494
  • Abstract
    In this study, we attempt to enhance the electrical conductivity of polyimide (PI) by non-covalently modified multiwall carbon nanotubes (MWNTs). The multiwall carbon nanotubes were first oxidized (o-CNT) and modified with nitric acid (n-CNT). The o-CNT and n-CNT were then modified with anionie surfactant (Sodium dodecylbenzene sulfonate) (SDBS) to improve their dispersion in the PI matrix. We also compare the properties of the surfactant modified MWNTs prepared by filtration or centrifuge. We confirmed the successful preparation of the surfactant modified MWNTs by Fourier transform infrared (FTIR), scanning electron microscope (SEM) and UV visible spectroscopy. Furthermore, the thermal stability, electrical and mechanical properties of PI/MWNT nanocomposites can be increased through in-situ polymerization.
  • Keywords
    Fourier transforms; carbon nanotubes; electrical conductivity; polymerisation; scanning electron microscopy; surfactants; thermal stability; ultraviolet spectroscopy; FTIR; Fourier transform infrared; SEM; UV visible spectroscopy; electrical conductivity; electrical properties; in-situ polymerization; mechanical properties; multiwall carbon nanotubes; n-CNT; nitric acid; o-CNT; scanning electron microscope; surfactant modified MWNT/polyimide composites; thermal stability; Conferences; Nanoelectronics; carbon nanotube; polyimide; surfactant;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2013 IEEE 5th International
  • Conference_Location
    Singapore
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4673-4840-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2013.6466087
  • Filename
    6466087