Title :
WIPAL: Window-based parallel layout decomposition in double patterning lithography
Author :
Hailong Yao ; Yici Cai ; Wei Zhao
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
As VLSI technology nodes continue to scale down, double patterning (DP) lithography has become the most promising interim solutions due to the delay in the deployment of next generation lithography (e.g., EUV). DP requires the partitioning of the layout patterns into two different masks, a procedure called layout decomposition. Layout decomposition is a key computational step that is necessary for double patterning technology. Existing works on layout decomposition are all single-threaded, which is not scalable in runtime and/or memory for large industrial layouts. This paper presents the first window-based parallel layout decomposition methods for improving both runtime and memory consumption. Experimental results are promising.
Keywords :
VLSI; integrated circuit layout; lithography; DP lithography; VLSI technology node; WIPAL; double patterning lithography; industrial layouts; layout pattern partitioning; next generation lithography; single-threaded layout decomposition; window-based parallel layout decomposition; Color; Layout; Lithography; Memory management; Routing; Runtime; Servers; double patterning lithography; layout decomposition; parallel computing;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6466674