DocumentCode
597819
Title
WIPAL: Window-based parallel layout decomposition in double patterning lithography
Author
Hailong Yao ; Yici Cai ; Wei Zhao
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fYear
2012
fDate
Oct. 29 2012-Nov. 1 2012
Firstpage
1
Lastpage
4
Abstract
As VLSI technology nodes continue to scale down, double patterning (DP) lithography has become the most promising interim solutions due to the delay in the deployment of next generation lithography (e.g., EUV). DP requires the partitioning of the layout patterns into two different masks, a procedure called layout decomposition. Layout decomposition is a key computational step that is necessary for double patterning technology. Existing works on layout decomposition are all single-threaded, which is not scalable in runtime and/or memory for large industrial layouts. This paper presents the first window-based parallel layout decomposition methods for improving both runtime and memory consumption. Experimental results are promising.
Keywords
VLSI; integrated circuit layout; lithography; DP lithography; VLSI technology node; WIPAL; double patterning lithography; industrial layouts; layout pattern partitioning; next generation lithography; single-threaded layout decomposition; window-based parallel layout decomposition; Color; Layout; Lithography; Memory management; Routing; Runtime; Servers; double patterning lithography; layout decomposition; parallel computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4673-2474-8
Type
conf
DOI
10.1109/ICSICT.2012.6466674
Filename
6466674
Link To Document