DocumentCode :
597830
Title :
Investigation on Channel Hot Carrier degradation of ultra deep submicron SOI pMOSFETs
Author :
Liang-Xi Huang ; Xia An ; Fei Tan ; Wei-Kang Wu ; Ru Huang
Author_Institution :
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
3
Abstract :
The bias dependence of Channel Hot Carrier (CHC) degradation in 0.18μm SOI pMOSFETs is investigated in this paper. Two classical bias modes (Vg@Isubmax and Vg=Vd) were applied to analyze the CHC degradation behavior of SOI pMOSFETs. The results show that at low Vg, hot carriers injection produced by impact ionization is the main factor contributed to degradation. However, the degradation stressed at high Vg is controlled by both CHC and NBTI effect, showing the NBTI-like behavior at room temperature which indicates that NBTI effect is the dominant factor. A possible mechanism is put forward to explain the enhanced CHC degradation under Vg=Vd compared with pure NBTI degradation. The influence of floating body on the performance degradation of PDSOI devices is also investigated.
Keywords :
MOSFET; elemental semiconductors; hot carriers; impact ionisation; negative bias temperature instability; semiconductor device reliability; silicon; silicon-on-insulator; CHC degradation behavior; CHC effect; NBTI effect; PDSOI devices; bias dependence; channel hot carrier degradation; degradation stress; enhanced CHC degradation; floating body; impact ionization; size 0.18 mum; ultradeep submicron SOI pMOSFET; Degradation; Hot carriers; Impact ionization; MOSFETs; Stress; Substrates; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6466707
Filename :
6466707
Link To Document :
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