DocumentCode :
597844
Title :
Numerical simulation of DB-NBTI degradation caused by a sheet of interface charge
Author :
Si-Wen Huang ; Wei He ; Xiao-Jin Zhao ; Jian-Min Cao
Author_Institution :
Coll. of Electron. Sci. & Technol., Shenzhen Univ., Shenzhen, China
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
3
Abstract :
In this paper, we combine the Reaction-Diffusion Model of Negative Bias Temperature Instability (NBTI) with the two-dimension semiconductor device simulator, and calculate the interfacial charge after extracting the electric field across gate oxide and the hole density at Si/SiO2 interface. A novel non-uniform interface charge distribution model is proposed by taking a sheet of interface charge into account so that the device degradation of drain bias NBTI (DB-NBTI) can be simulated and analyzed. The results show that, as for DB-NBTI, under constant drain bias and part of NBTI interface charge still degrade with the exponent value of 1/6 of the Reaction-Diffusion Model, the degradation of threshold voltage deviates from the traditional power exponent of 1/6. The deviation of degradation curve can be explained by the comparison and analysis of the hole density at the Si/Si02 interface. These results are helpful in pushing DB-NBTI study, and improving the model and methods of its numerical simulation.
Keywords :
electric charge; hole density; negative bias temperature instability; numerical analysis; reaction-diffusion systems; silicon compounds; DB-NBTI degradation; NBTI interface charge; Si-SiO2; constant drain bias; degradation curve; device degradation; drain bias NBTI; electric field; gate oxide; hole density; negative bias temperature instability; nonuniform interface charge distribution model; numerical simulation; power exponent; reaction-diffusion model; threshold voltage degradation; two-dimension semiconductor device simulator; Abstracts; Educational institutions; Logic gates; MOSFET circuits; Numerical models; Reliability; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6466736
Filename :
6466736
Link To Document :
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