DocumentCode :
59808
Title :
Review of Silicon Power Semiconductor Technologies for Power Supply on Chip and Power Supply in Package Applications
Author :
Disney, Don ; Shen, Z. John
Author_Institution :
Avogy Inc., San Jose, CA, USA
Volume :
28
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
4168
Lastpage :
4181
Abstract :
This paper provides an overview of the fundamental operating principles of power semiconductor devices and reviews the state-of-the-art power device technologies which are most relevant to the realization of power supply on chip and power supply in package solutions. Power switching devices are divided into four categories low-voltage discrete transistors, high-voltage discrete transistors, low-voltage power ICs, and high-voltage power ICs. Advantages and disadvantages of different device technologies are compared and analyzed. Future technology trends are discussed.
Keywords :
elemental semiconductors; power integrated circuits; power semiconductor devices; power supply circuits; silicon; system-in-package; system-on-chip; high-voltage discrete transistors; high-voltage power IC; low-voltage discrete transistors; low-voltage power IC; power semiconductor technologies; power supply in package; power supply on chip; Junctions; Logic gates; Power MOSFET; Silicon on insulator technology; Switches; Transistors; Power converters; power integrated circuits; power semiconductor devices; power transistors; system-in-a-package; system-on-a-chip;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2013.2242095
Filename :
6463482
Link To Document :
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