• DocumentCode
    59808
  • Title

    Review of Silicon Power Semiconductor Technologies for Power Supply on Chip and Power Supply in Package Applications

  • Author

    Disney, Don ; Shen, Z. John

  • Author_Institution
    Avogy Inc., San Jose, CA, USA
  • Volume
    28
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    4168
  • Lastpage
    4181
  • Abstract
    This paper provides an overview of the fundamental operating principles of power semiconductor devices and reviews the state-of-the-art power device technologies which are most relevant to the realization of power supply on chip and power supply in package solutions. Power switching devices are divided into four categories low-voltage discrete transistors, high-voltage discrete transistors, low-voltage power ICs, and high-voltage power ICs. Advantages and disadvantages of different device technologies are compared and analyzed. Future technology trends are discussed.
  • Keywords
    elemental semiconductors; power integrated circuits; power semiconductor devices; power supply circuits; silicon; system-in-package; system-on-chip; high-voltage discrete transistors; high-voltage power IC; low-voltage discrete transistors; low-voltage power IC; power semiconductor technologies; power supply in package; power supply on chip; Junctions; Logic gates; Power MOSFET; Silicon on insulator technology; Switches; Transistors; Power converters; power integrated circuits; power semiconductor devices; power transistors; system-in-a-package; system-on-a-chip;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2013.2242095
  • Filename
    6463482