Title :
An influence factor of high reliable thermosonic au wire-bonding
Author :
Bin Wang ; Xiu-ying Mo ; Hong-Wei Li
Author_Institution :
Sci. & Technol. on Electron. Test & Meas. Lab., Qingdao, China
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
Thermosonic bonding has been found to be a promising process in microelectronic packaging industry. It provides electrical interconnects between semi-conductor, hybrid, or microwave devices. Gold wire wedge bonding has been widely used in microwave communications and surveillance projects for its nicer high frequency characteristics. In this thesis, the roughness of the bonding tools tip as one of the factors which influence the bonding quality was presented. The mechanism and the results of experimentation were introduced in detail.
Keywords :
gold; integrated circuit interconnections; tape automated bonding; bonding quality; bonding tools tip; electrical interconnects; frequency characteristics; gold wire wedge bonding; hybrid device; influence factor; microelectronic packaging industry; microwave communications; microwave device; semiconductor device; surveillance projects; thermosonic gold wire-bonding; Acoustics; Bonding; Force; Gold; Rough surfaces; Surface roughness; Wires; bonding quality; influence factor; roughness; wire bonding;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6467732
