DocumentCode :
59850
Title :
Lumped Dynamic Electrothermal Model of IGBT Module of Inverters
Author :
Batard, Christophe ; Ginot, Nicolas ; Antonios, Joe
Author_Institution :
Rennes Lab., Lunam Univ., Nantes, France
Volume :
5
Issue :
3
fYear :
2015
fDate :
Mar-15
Firstpage :
355
Lastpage :
364
Abstract :
This paper presents a lumped dynamic electrothermal model of an insulated gate bipolar transistor module of inverters. The thermal model consists of a 3-D network of RC cells constructed for time-dependent operation. The network was found to be precise for determining the temperature excursion of diodes and transistors subsequent to time-dependent power losses. Thermal resistances and capacitances accounting for heat spreading and thermal penetration depth effects were introduced. Electrothermal simulations carried out on a 1200 V-300 A module with a time-dependent average power loss were found to be in good agreement with experiments using infrared thermal imaging. This paper focuses on very-low-frequency behavior (less than 1 Hz) at a switching frequency of 10 kHz.
Keywords :
insulated gate bipolar transistors; invertors; semiconductor device models; semiconductor diodes; 3-D network; IGBT module; RC cells; current 300 A; diodes; electrothermal simulations; frequency 10 kHz; heat spreading; infrared thermal imaging; insulated gate bipolar transistor; inverters; lumped dynamic electrothermal model; thermal capacitances; thermal penetration depth effects; thermal resistances; time-dependent average power loss; time-dependent power losses; voltage 1200 V; Heating; Insulated gate bipolar transistors; Inverters; Load modeling; Semiconductor diodes; Switches; Transistors; Electrical-thermal cosimulation; heat transfer; multiscale problem; semiconductor devices; thermal models; thermal models.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2392625
Filename :
7036118
Link To Document :
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