Title :
Electrothermal modelling of novel through-silicon carbon nanotube bundle vias (TS-CNTBV)
Author :
Yun-Fan Liu ; Zheng Yong ; Yan-Song Jiao ; Wen-Sheng Zhao ; Wen-Yan Yin
Author_Institution :
Zhejiang Provincial Key Lab. for Sensing Technol., Zhejiang Univ., Hangzhou, China
Abstract :
In this paper, we at first propose an almost-carbon interconnects structure consisting of through-silicon carbon nanotube bundle vias (TS-CNTBV), graphene-based transmission lines (GTL) and metal bumps. In order to characterize its electrical performance, an effective complex conductivity of the CNT bundle is introduced and studied for different temperatures and CNT radii. Further, the TS-CNTBV transmission characteristics are investigated based on its distributed transmission line model, and in particular, effects of metallic bump attached to the TS-CNTBV are considered and treated in an appropriate way.
Keywords :
carbon nanotubes; graphene; integrated circuit interconnections; integrated circuit modelling; three-dimensional integrated circuits; transmission lines; C; GTL; TS-CNTBV; distributed transmission line model; electrothermal modelling; graphene based transmission lines; metal bumps; through silicon carbon nanotube bundle vias; Carbon nanotubes; Conductivity; Electron devices; Graphene; Integrated circuit interconnections; Integrated circuit modeling; Through-silicon vias;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469391
