DocumentCode :
598766
Title :
Crosstalk analysis of multigigabit links on high density interconnects PCB using IBIS AMI models
Author :
Chastang, C. ; Gautier, Cyrille ; Amedeo, Alexandre ; Costa, Francois
Author_Institution :
THALES Commun. & Security, Colombes, France
fYear :
2012
fDate :
9-11 Dec. 2012
Firstpage :
223
Lastpage :
226
Abstract :
This study presents the use of a design flow and remarkable results of signal integrity crosstalk simulations of Multi-GigaHertz serial links in high density printed circuit boards, which becomes mandatory due to increase of data rates.
Keywords :
crosstalk; printed circuit interconnections; printed circuits; IBIS AMI model; crosstalk analysis; high density interconnects PCB; high density printed circuit boards; multigigabit links; multigigahertz serial links; signal integrity crosstalk simulation; Computational modeling; Crosstalk; Integrated circuit modeling; Jitter; Microstrip; Packaging; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
Type :
conf
DOI :
10.1109/EDAPS.2012.6469432
Filename :
6469432
Link To Document :
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