DocumentCode :
59894
Title :
General-Purpose, Parallel and Reversible Microfluidic Interconnects
Author :
Wagler, Patrick Fred ; Tangen, Uwe ; Ott, Johannes ; McCaskill, John Simpson
Author_Institution :
Fac. of Chem. & Biochem., Microsyst. Chem., Ruhr-Univ. Bochum, Bochum, Germany
Volume :
5
Issue :
3
fYear :
2015
fDate :
Mar-15
Firstpage :
291
Lastpage :
300
Abstract :
The packaging of microfluidic chips is a limiting factor in their ease of use and widespread application. A simple and versatile casting procedure to fabricate a parallel minimal dead-volume connector using polydimethylsiloxane elastomers without the application of any adhesive materials is demonstrated. The interconnections reversibly join standard-sized teflon, glass, or plastic tubing to modular microfluidic systems with minimal dead volume for biological and chemical applications. Parallel port connectors with 18 and 35 channels have been developed to illustrate the applicability of this novel universal fluidic interface to the large-scale integration of microfluidic (chip) devices, which will scale without problem to 100 parallel channels. The advantages of this novel interface are evaluated in relation to a comprehensive classification and analysis of other world to chip interconnection technologies.
Keywords :
casting; elastomers; integrated circuit interconnections; large scale integration; microfluidics; biological applications; casting; chemical applications; general-purpose microfluidic interconnects; glass; large-scale integration; microfluidic chips; packaging; parallel microfluidic interconnects; parallel minimal dead-volume connector; parallel port connectors; plastic tubing; polydimethylsiloxane elastomers; reversible microfluidic interconnects; standard-sized teflon; universal fluidic interface; Casting; Chemicals; Connectors; Electron tubes; Fabrication; Needles; Silicon; Interconnections; large-scale-integration (LSI); microelectrodes; microfluidics; polydimethylsiloxane (PDMS); polydimethylsiloxane (PDMS).;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2395815
Filename :
7036123
Link To Document :
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