DocumentCode
599897
Title
Strain relaxation behaviour in germanium-on-insulator fabri-cated by ion implantation
Author
Kim, Tae Hyun ; Belay, Kidane ; Llewellyn, D. ; Elliman, R. ; Choi, Daniel ; Luther-Davies, Barry
Author_Institution
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
fYear
2012
fDate
12-14 Dec. 2012
Firstpage
167
Lastpage
168
Abstract
Single crystal Ge layers of different thickness were successfully formed on bulk SiO2 by ion implantation and oxidation techniques. Structural and compositional properties of the Ge layers were investigated by high-resolution transmission electron microscopy (HRTEM) and Raman spectroscopy. The quality of the resulting layers was found to be a function of the layer thickness.
Keywords
Raman spectroscopy; germanium; ion implantation; silicon compounds; stress relaxation; transmission electron microscopy; Ge-SiO2; Raman spectroscopy; germanium-on-insulator; high resolution transmission electron microscopy HRTEM; ion implantation; layer thickness; oxidation technique; strain relaxation; Educational institutions; Oxidation; Silicon; Silicon on insulator technology; Strain; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronic and Microelectronic Materials & Devices (COMMAD), 2012 Conference on
Conference_Location
Melbourne, VIC
ISSN
1097-2137
Print_ISBN
978-1-4673-3047-3
Type
conf
DOI
10.1109/COMMAD.2012.6472413
Filename
6472413
Link To Document