DocumentCode
600574
Title
Planar fiber packaging method for silicon photonic integrated circuits
Author
Snyder, Brett ; O´Brien, Peter
Author_Institution
Tyndall Nat. Inst., Univ. Coll. Cork, Cork, Ireland
fYear
2012
fDate
4-8 March 2012
Firstpage
1
Lastpage
3
Abstract
A novel method for fiber packaging silicon waveguides is presented. The process uses angled fibers and capillary action of UV-cure epoxy. The technique is suited to passive alignment and can be scaled for fiber arrays.
Keywords
elemental semiconductors; integrated circuit packaging; integrated optics; optical waveguides; silicon; Si; UV-cure epoxy capillary action; fiber arrays; fiber packaging waveguides; photonic integrated circuits; planar fiber packaging; Couplings; Gratings; Optical fiber couplers; Optical fiber devices; Packaging; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference
Conference_Location
Los Angeles, CA
ISSN
pending
Print_ISBN
978-1-4673-0262-3
Type
conf
Filename
6476397
Link To Document