QoS 3D-HoC hybrid-on-chip communication structure for dynamic 3D-MPSoCs

Three dimension Multi processors System-on-Chip (3D-MPSoCs) hold promises to allow the development of compact and efficient devices. They support many applications on the same die, able of being mapped dynamically during the execution time. Each application may have different communication requirements. Quality-of-Service (QoS) can be implemented at the communication structure (CS) to support the communication requirements of the dynamic 3D-MPSoC. Our work proposes QoS 3D-HoC, a new 3D-CS that implements the QoS. We evaluate the performance of our architecture over several 3D-MPSoC synthetic and real traffic scenarios and estimate their impact overall CS performance. We compare our architecture against the previous 3D-CS with and without QoS and show that our approach meets the communication requirements while reducing the latency and power up to 87% and 39%, respectively when compared to single 3D-NoC.