• DocumentCode
    601048
  • Title

    Optimization of 65nm CMOS passive devices to design a 16 dBm-Psat 60 GHz power amplifier

  • Author

    Aloui, S. ; Leite, B. ; Demirel, N. ; Plana, R. ; Belot, Didier ; Kerherve, Eric

  • Author_Institution
    IMS Lab., Univ. of Bordeaux, Talence, France
  • fYear
    2013
  • fDate
    Feb. 27 2013-March 1 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The optimization of passive devices is performed to contribute to the design of a linear 60 GHz Power Amplifier (PA). The difficulty in this design consists in the use of thin digital 7 metal layers (1P7M) Back End of Line (BEOL) and Low Power (LP) transistors dedicated for pure digital applications. In this context, compact inductors and Transmission lines (T-lines) are analyzed, measured and compared at millimeter-Wave (mmW) frequencies. Moreover, a technique of Common Mode Rejection Ration (CMRR) improvement applied for baluns is presented and validated with measurements. A Parallel PA that combines 8 high-efficiency unit power cells is designed using 65nm CMOS technology from STMicroelectronics. The experimental results show a saturated output power (Psat) of 16 dBm with a 14 dBm 1dB-output compression point (OCP1dB).
  • Keywords
    CMOS analogue integrated circuits; MOSFET; baluns; inductors; millimetre wave integrated circuits; millimetre wave power amplifiers; optimisation; passive networks; 1P7M; BEOL; CMOS passive device; CMRR; LP; PA; STMicroelectronics; T-line; back end of line; baluns; common mode rejection ration; frequency 60 GHz; gain 1 dB; high-efficiency unit power cell; inductor; linear power amplifier; low power transistor; millimeter-wave frequency; optimization; pure digital application; size 65 nm; thin digital 7 metal layers; transmission line; CMOS integrated circuits; Coplanar waveguides; Couplings; Gain; Impedance matching; Inductors; Transistors; 60GHz; CMOS; Power amplifiers; baluns;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (LASCAS), 2013 IEEE Fourth Latin American Symposium on
  • Conference_Location
    Cusco
  • Print_ISBN
    978-1-4673-4897-3
  • Type

    conf

  • DOI
    10.1109/LASCAS.2013.6519034
  • Filename
    6519034