DocumentCode
601061
Title
A new delay distribution model to take long-term degradation into account
Author
Tsukiyama, S. ; Fukui, M. ; Kambe, T.
Author_Institution
Dept. of EEC Eng., Chuo Univ., Tokyo, Japan
fYear
2013
fDate
Feb. 27 2013-March 1 2013
Firstpage
1
Lastpage
4
Abstract
The long-term degradation due to aging such as NBTI (Negative Bias Temperature Instability) is a hot issue in the current circuit design using nanometer process technologies, since it causes a delay fault in the field. In order to resolve the problem, we must estimate delay variation caused by long-term degradation in design stage, but over estimation must be avoided so as to make timing design easier. If we can treat such a variation statistically, and if we treat it together with delay variations due to process variability, then we can reduce over margin in timing design. Moreover, such a statistical static timing analyzer treating process variability and long-term degradation together help us to select an appropriate set of paths for which field testing are conducted to detect delay faults. In this paper, we propose a new delay model taking long-term degradation into account for statistical static timing analysis, and propose an algorithm for finding the statistical maximum, which is one of key operations in statistical static timing analysis. We also show a few experimental results demonstrating the effect of the algorithm.
Keywords
ageing; circuit reliability; fault diagnosis; negative bias temperature instability; network synthesis; statistical analysis; NBTI; aging; circuit design; delay distribution model; delay fault detection; delay variation estimation; design stage; field testing; long-term degradation; nanometer process technologies; negative bias temperature instability; process variability; statistical static timing analysis; statistical static timing analyzer; timing design; Algorithm design and analysis; Approximation algorithms; Correlation coefficient; Degradation; Delays; Estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (LASCAS), 2013 IEEE Fourth Latin American Symposium on
Conference_Location
Cusco
Print_ISBN
978-1-4673-4897-3
Type
conf
DOI
10.1109/LASCAS.2013.6519047
Filename
6519047
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