• DocumentCode
    601585
  • Title

    Full SiC power module with advanced structure and its solar inverter application

  • Author

    Hinata, Yuichiro ; Horio, Masafumi ; Ikeda, Yasuhiro ; Yamada, Ryota ; Takahashi, Y.

  • Author_Institution
    Electron. Device Lab., Fuji Electr. Co., Ltd., Nagano, Japan
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    604
  • Lastpage
    607
  • Abstract
    This paper describes advanced power module structure for high power and high frequency application with solar inverter system. This advanced power modules is applied full SiC semiconductor which has SiC MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and SiC SBD (Schottky Barrier Diode). This full SiC power module structure realizes high reliability with low thermal impedance by using these new three technology, i) power circuit board which has copper pins connected to power devices, ii) advanced ceramic insulated substrate that enables high heat dissipation is utilized to reduce thermal impedance and iii) full molded package achieves high temperature operation and high reliability. The power cycling test at high temperature (200deg.C), electrical characteristics and inverter system efficiency of this full SiC power module were evaluated and compared with conventional Si power module. The results showed that the power cycling lifetime has x50 capability, electrical characteristics has low loss and low turn-off surge voltage, and 99.0% of efficiency at solar inverter system.
  • Keywords
    Schottky diodes; ceramic insulation; cooling; invertors; modules; power MOSFET; power integrated circuits; power semiconductor diodes; printed circuits; semiconductor device packaging; semiconductor device reliability; silicon compounds; solar cells; SiC; SiC MOSFET; SiC SBD; advanced ceramic insulated substrate; advanced power module structure; electrical characteristics; heat dissipation; molded package; power circuit board; power cycling lifetime; power cycling test; power devices; reliability; solar inverter system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
  • Conference_Location
    Long Beach, CA
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4673-4354-1
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2013.6520272
  • Filename
    6520272