Title :
Thermoelectric Cooling for power electronics circuits: Modeling and applications
Author :
Cong Li ; Da Jiao ; Mohan, H. ; Feng Guo ; Jin Wang
Author_Institution :
Electr. & Comput. Eng. Dept., Ohio State Univ., Columbus, OH, USA
Abstract :
This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.
Keywords :
power electronics; reliability; semiconductor switches; temperature control; thermoelectric cooling; dynamic base temperature control; optimal operation range; power electronics circuits; power electronics switches; switch lifetime; system reliability; thermoelectric cooling; thermoelectric model;
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
Conference_Location :
Long Beach, CA
Print_ISBN :
978-1-4673-4354-1
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2013.6520770