Solder paramater sensitivity for Package-on-Package (POP) on fatigue life prediction

Author

Lim Han Bin ; Ong Kang Eu ; Azid, I.A.

Author_Institution

Engineering Campus, Sch. of Mech. Eng., USM, Nibong Tebal, Malaysia

fYear

2012

fDate

6-8 Nov. 2012

Firstpage

1

Lastpage

6

Abstract

Due to requirements of cost-saving and miniaturization, Package-on-Package (PoP) has recently gained popularity in many applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as common single die BGA.. In this research, solder joint fatigue life of PoP is analyzed in detail. 3D model is established for PoP by using ABAQUS design software with consideration of detailed design, realistic shape of solder ball and non-linear material properties. The fatigue model is based on the Hyperbolic Sine Creep Model and it is taken from the works of Park,Hong and Lau. [1] The critical solder ball is observed located at the inner ring of bottom solder balls which is in between SPBGA and test board. The results show that in general, solder ball diameter has no much effect on its fatigue life..

Keywords

ball grid arrays; fatigue; solders; 3D model; ABAQUS design software; SPBGA; board level solder joint reliability; cost saving; critical solder ball; fatigue life prediction; fatigue model; hyperbolic sine creep model; nonlinear material property; package on package; single die BGA; solder ball diameter; solder joint fatigue life; solder paramater sensitivity; test board; thermal cycling test;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International

Conference_Location

Ipoh

ISSN

1089-8190

Print_ISBN

978-1-4673-4384-8

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2012.6521831

Filename

6521831