DocumentCode
602623
Title
ESESC: A fast multicore simulator using Time-Based Sampling
Author
Ardestani, Ehsan K. ; Renau, Jose
Author_Institution
Dept. of Comput. Eng., Univ. of California Santa Cruz, Santa Cruz, CA, USA
fYear
2013
fDate
23-27 Feb. 2013
Firstpage
448
Lastpage
459
Abstract
Architects rely on simulation in their exploration of the design space. However, slow simulation speed caps their productivity and limits the depth of their exploration. Sampling has been a commonly used remedy. While sampling is shown to be an effective technique for single core processors, its application has been limited to simulation of multi-program, throughput applications only. This work presents Time-Based Sampling (TBS), a framework that is the first to enable sampling in simulation of multicore processors with virtually no limitation in terms of application type (multi-programmed or multithreaded), number of cores, homogeneity or heterogeneity of the simulated configuration (4.99% error averaged across all the evaluated configurations). TBS also is the first to enable integrated power and temperature evaluation in statistically sampled simulation of multicore systems (with 5.5% and 2.4% error on average, respectively). We implement an architectural simulator based on TBS, called ESESC, that provides a holistic set of tools for a fair evaluation of different architectures.
Keywords
multi-threading; multiprocessing programs; multiprocessing systems; sampling methods; ESESC; TBS framework; architectural simulator; design space; fast multicore simulator; multicore processor simulation; multicore systems; multiprogram simulation; multiprogrammed application; multithreaded application; simulated configuration heterogeneity; simulated configuration homogeneity; single core processors; statistically sampled simulation; throughput applications; time-based sampling; Computational modeling; Instruction sets; Multicore processing; Synchronization;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computer Architecture (HPCA2013), 2013 IEEE 19th International Symposium on
Conference_Location
Shenzhen
ISSN
1530-0897
Print_ISBN
978-1-4673-5585-8
Type
conf
DOI
10.1109/HPCA.2013.6522340
Filename
6522340
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