Title :
Room temperature microjoining of qVGA class area-bump array using cone bump
Author :
Shuto, Takanori ; Iwanabe, Keiichiro ; Li Jing Qiu ; Asano, Takashi
Author_Institution :
Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
Abstract :
We show that room temperature microjoining a 332 × 268 array of bumps can be realized by using ultrasonic bonding of cone-shaped microbump. 20 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A flat planar electrode made of electoplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in ambient air. Electrical connection test shows all bump connections with low resistance have been achieved.
Keywords :
bonding processes; electroplating; joining processes; microelectrodes; photolithography; cone-shaped microbump; electrical connection; electroplating; flat planar electrode; photolithography; pitch area array; qVGA class area-bump array; room temperature microjoining; temperature 293 K to 298 K; ultrasonic bonding;
Conference_Titel :
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-2654-4
DOI :
10.1109/ICSJ.2012.6523389