Board level drop test modeling

Author

Amagai, Masazumi ; Seungmin, J.

Author_Institution

Modeling Group, TMG Japan, Miho, Japan

fYear

2012

fDate

10-12 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

Recently, drop test reliability has become a major concern for mobile electronic products. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased stress in solder joints during drop impacts due to their complicate structures. In this study, evaluations of test board material properties, damping parameters, the correlation of displacements and strains between model and drop test and also parameters of fail cyclic life prediction were performed with three point bend tests, acceleration sensors, strain gauges, a high speed camera, drop testers, dynamic finite element models.

Keywords

cameras; electronic products; finite element analysis; materials testing; reliability; solders; strain gauges; system-in-package; SIP; acceleration sensors; board level drop test modeling; damping parameters; displacement correlation; drop impacts; drop test reliability; dynamic finite element models; fail cyclic life prediction; high speed camera; mobile electronic products; package-on-package; point bend tests; solder joints; stacked-die-package; strain gauges; system-in-package; test board material property;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2012 2nd IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4673-2654-4

Type

conf

DOI

10.1109/ICSJ.2012.6523419

Filename

6523419