Title :
Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding
Author :
Mimatsu, Hayata ; Mizuno, Jun ; Kasahara, T. ; Saito, Masato ; Nishikawa, Hisashi ; Shoji, Shuji
Author_Institution :
Nano-Sci. & Nano-Eng., Waseda Univ., Tokyo, Japan
Abstract :
In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100 μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100 °C and 250 °C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.
Keywords :
X-ray photoelectron spectra; annealing; gold; nanoporous materials; sheet materials; silver; ultrasonic bonding; Au-Ag; X-ray photoelectron spectroscopy; XPS; annealing temperatures; bonding layer; bonding strengths; chemical composition; chemical property; dealloying; joint layer; liquid nitrogen; low-temperature bonding; nano-porous sheets; nanoporous gold-silver sheets; porous structure; temperature 100 C to 250 C;
Conference_Titel :
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-2654-4
DOI :
10.1109/ICSJ.2012.6523449