Development of low temperature curable positive tone photosensitive dielectric material

Recently, low temperature curable photosensitive dielectric materials are attracting much attention in semiconductor package application to avoid thermal damages of the semiconductor devices. AH-1000 is a low temperature curable positive tone photo- definable material. In this paper, we report the mechanical, thermal, and adhesion property of AH-1000 together with its chemical resistance. A wafer level package (WLP) using AH-1000 as redistribution layers indicates that AH-1000 has enough mechanical toughness. It also suggests that higher elongation and lower Young´s modulus are effective to eliminate mechanical stress to solder balls for dielectrics.