DocumentCode
602794
Title
Novel compact bandpass filters for high-density packaging applications
Author
Kushta, Taras ; Harada, Tatsuya
Author_Institution
Central Res. Labs., NEC Corp., Kawasaki, Japan
fYear
2012
fDate
10-12 Dec. 2012
Firstpage
1
Lastpage
4
Abstract
In this paper, a new concept providing not only compactness of a filtering component, but also its effective integration in a chip-package system has been presented. This concept is based on a three-dimensional (3-D) design approach and an anisotropic artificial dielectric of a high permittivity formed in a predetermined area of a multilayer substrate used to construct the component. In the 3-D approach, a planar transmission line segment and a resonator formed vertically in the substrate are applied.
Keywords
band-pass filters; chip scale packaging; permittivity; 3D design approach; anisotropic artificial dielectric; chip-package system; compact bandpass filter; filtering component; high-density packaging; multilayer substrate; permittivity; planar transmission line segment; resonator; three-dimensional approach;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location
Kyoto
Print_ISBN
978-1-4673-2654-4
Type
conf
DOI
10.1109/ICSJ.2012.6523464
Filename
6523464
Link To Document