DocumentCode :
602801
Title :
Silicon and the wide bandgap semiconductors, shaping the future power electronic device market
Author :
Gammon, Peter
Author_Institution :
Sch. of Eng., Univ. of Warwick, Coventry, UK
fYear :
2013
fDate :
19-21 March 2013
Firstpage :
9
Lastpage :
13
Abstract :
In this paper, the current state of the power electronic device market is reviewed in light of the increased challenge upon Si from the wide bandgap semiconductors SiC and GaN. It is suggested that for the next ten years Si will continue its dominance both at the low voltage, and at the high voltage, high current ends of the market. However, SiC in particular is most likely to make a robust challenge upon the 500-6.5 kV market, in application areas such as automotive and photovoltaic converters and in PFC power supplies. As materials issues such as defect densities and epitaxial layer thicknesses improve then the emergence of bipolar SiC devices could in 10-20 years see it challenge in the high voltage, high current end of the market also.
Keywords :
III-V semiconductors; elemental semiconductors; gallium compounds; power convertors; power factor correction; power semiconductor devices; power supplies to apparatus; semiconductor epitaxial layers; silicon; silicon compounds; wide band gap semiconductors; GaN; PFC power supply; Si; SiC; automotive; bipolar device; defect density; epitaxial layer thickness; future power electronic device market; photovoltaic converter; time 10 year to 20 year; voltage 500 kV to 6.5 kV; wide bandgap semiconductor; Educational institutions; Gallium nitride; Insulated gate bipolar transistors; Lead; Logic gates; Silicon; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultimate Integration on Silicon (ULIS), 2013 14th International Conference on
Conference_Location :
Coventry
Print_ISBN :
978-1-4673-4800-3
Electronic_ISBN :
978-1-4673-4801-0
Type :
conf
DOI :
10.1109/ULIS.2013.6523479
Filename :
6523479
Link To Document :
بازگشت