DocumentCode :
602917
Title :
SRAM bit-line electromigration mechanism and its prevention scheme
Author :
Zhong Guan ; Marek-Sadowska, Malgorzata ; Nassif, S.
Author_Institution :
ECE Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
fYear :
2013
fDate :
4-6 March 2013
Firstpage :
286
Lastpage :
293
Abstract :
In this paper, we demonstrate that signal lines in SRAM arrays are prone to electromigration (EM). Our analysis shows that the read operation can cause unidirectional current flow in bit-lines. Thus the length of bit-lines should be bounded not only by performance requirements, but also by the Blech length constraint to avoid EM. We propose a method of determining the bit-line width under layout constraints to maximize the number of cells attached to a bit-line, while ensuing the reliability of the bit-line and maintaining SRAM performance. We also study the effects of SRAM parameter variations on the EM-safe bit-line length. Simulation results show that the EM-safe bit-line length decreases as technology scales, temperature or frequency rise, and parameter variations increase.
Keywords :
SRAM chips; electromigration; integrated circuit layout; integrated circuit reliability; Blech length constraint; EM-safe bit-line length; SRAM arrays; SRAM bit-line electromigration mechanism; SRAM parameter variations; bit-line reliability; layout constraints; signal lines; unidirectional current flow; Capacitance; Current density; Electromigration; Leakage currents; SRAM cells; Wires; Electromigration; SRAM; bit-line; optimization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4673-4951-2
Type :
conf
DOI :
10.1109/ISQED.2013.6523624
Filename :
6523624
Link To Document :
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