• DocumentCode
    602922
  • Title

    Configurable redundant via-aware standard cell design considering multi-via mechanism

  • Author

    Tsang-Chi Kan ; Hung-Ming Hong ; Ying-Jung Chen ; Shanq-Jang Ruan

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    322
  • Lastpage
    326
  • Abstract
    Well designed redundant via-aware standard cells (SCs) can increase the redundant via1 insertion rate in cell-based designs. However, with conventional methods, manual and visual-based check are required to locate pins and tune geometries in layouts, which can be very time consuming and unreliable. Instead, an O(NlogN) via-aware standard cell optimization algorithm is developed. The proposed method considers various redundant via configurations such as double-via and rectangle-via which effectively increase the redundant via insertion rate for both concurrent routing and post-layout optimization. As a result, the proposed scheme not only addresses the problem of a low via1 insertion rate in nanometer regimes, but also demonstrates an efficient automatic layout optimizer for designing standard cells. Compared to the conventional standard library, the proposed method saves considerable design effort and time. Experimental results reveal that the proposed method effectively improves the redundant via1 insertion rate by a total of 26.3%.
  • Keywords
    application specific integrated circuits; cellular arrays; optimisation; SC; automatie layout optimizer; concurrent routing; configurable redundant via-aware standard cell design; multi via mechanism; post-layout optimization; standard cell optimization algorithm; standard library; Abstracts; Libraries; Pins; Reliability engineering; Routing; Standards; Design for manufacturability (DFM); layout; redundant via; standard cell (SC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523629
  • Filename
    6523629