DocumentCode :
602922
Title :
Configurable redundant via-aware standard cell design considering multi-via mechanism
Author :
Tsang-Chi Kan ; Hung-Ming Hong ; Ying-Jung Chen ; Shanq-Jang Ruan
Author_Institution :
Dept. of Electron. & Comput. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
fYear :
2013
fDate :
4-6 March 2013
Firstpage :
322
Lastpage :
326
Abstract :
Well designed redundant via-aware standard cells (SCs) can increase the redundant via1 insertion rate in cell-based designs. However, with conventional methods, manual and visual-based check are required to locate pins and tune geometries in layouts, which can be very time consuming and unreliable. Instead, an O(NlogN) via-aware standard cell optimization algorithm is developed. The proposed method considers various redundant via configurations such as double-via and rectangle-via which effectively increase the redundant via insertion rate for both concurrent routing and post-layout optimization. As a result, the proposed scheme not only addresses the problem of a low via1 insertion rate in nanometer regimes, but also demonstrates an efficient automatic layout optimizer for designing standard cells. Compared to the conventional standard library, the proposed method saves considerable design effort and time. Experimental results reveal that the proposed method effectively improves the redundant via1 insertion rate by a total of 26.3%.
Keywords :
application specific integrated circuits; cellular arrays; optimisation; SC; automatie layout optimizer; concurrent routing; configurable redundant via-aware standard cell design; multi via mechanism; post-layout optimization; standard cell optimization algorithm; standard library; Abstracts; Libraries; Pins; Reliability engineering; Routing; Standards; Design for manufacturability (DFM); layout; redundant via; standard cell (SC);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4673-4951-2
Type :
conf
DOI :
10.1109/ISQED.2013.6523629
Filename :
6523629
Link To Document :
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