Title :
CPDI: Cross-power-domain interface circuit design in monolithic 3D technology
Author :
Jing Xie ; Yang Du ; Yuan Xie
Author_Institution :
Pennsylvania State Univ., University Park, PA, USA
Abstract :
Optimizing energy consumption for electronic systems has been an important design focus. Multi-power domain design is widely used for low power and high performance applications. Data transfer between power domains needs a cross power domain interface (CPDI). The existing level-conversion flip-flop (LCFF) structures all need dual power rails, which leads to large area and performance overhead. In this paper, we propose a CPDI circuit utilizing monolithic 3D technology. This interface functions as a flip-flop and provides reliable data conversion from one power domain to another. Our design separates power rails in each tier, substantially reducing physical design complexity and area penalty. The design is implemented in a 45nm low power technology. It shows 20%-35% smaller clock to Q and 30% energy saving comparing with existing LCFF designs. The proposed design also shows better robustness with ±10% voltage variation.
Keywords :
flip-flops; integrated circuit design; power consumption; three-dimensional integrated circuits; CPDI circuit; LCFF structure; cross-power-domain interface circuit design; data transfer; energy consumption; energy saving; level-conversion flip-flop structure; monolithic 3D technology; power technology; size 45 nm; Delays; MOS devices; Flip-Flop; Level Shifter; Monolithic 3D; Multi-Power Domain;
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4673-4951-2
DOI :
10.1109/ISQED.2013.6523649