• DocumentCode
    602960
  • Title

    SUALD: Spacing uniformity-aware layout decomposition in triple patterning lithography

  • Author

    Zihao Chen ; Hailong Yao ; Yici Cai

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    566
  • Lastpage
    571
  • Abstract
    In triple patterning lithography (TPL), balanced feature density on each layout mask helps facilitate the following OPC process. This paper presents the first spacing uniformity-aware layout decomposition method, called SUALD, which formulates the density optimization problem in TPL based on the spacings between locally adjacent features on each colored layout mask, and hence enhances the patterning quality. Based on the new density formulation, a spacing uniformity graph is built using the Voronoi diagram. An effective heuristic triple partitioning algorithm is also proposed for TPL layout decomposition. Experimental results are very promising and show that SUALD obtains 69% and 40% improvements in average in the presented density metrics over an integer linear programming method without density control.
  • Keywords
    computational geometry; graph theory; masks; optimisation; proximity effect (lithography); OPC process; SUALD; TPL; Voronoi diagram; balanced feature density; colored layout mask; density formulation; density optimization problem; heuristic triple partitioning; integer linear programming; optical proximity correction; patterning quality; spacing uniformity graph; spacing uniformity-aware layout decomposition; triple patterning lithography; Color; Frequency modulation; Layout; Measurement; Optimization; Partitioning algorithms; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523667
  • Filename
    6523667