DocumentCode :
602962
Title :
Analysis, modeling and silicon correlation of low-voltage flop data retention in 28nm process technology
Author :
Datta, Amitava ; Abu-Rahma, M. ; Dasnurkar, S. ; Rasouli, H. ; Tamjidi, S. ; Ming Cai ; Sengupta, Sabyasachi ; Chidambaram, P. ; Thirumala, R. ; Kulkarni, Nandkumar ; Seeram, P. ; Bhadri, P. ; Patel, Pragati ; Sei Seung Yoon ; Terzioglu, E.
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
fYear :
2013
fDate :
4-6 March 2013
Firstpage :
580
Lastpage :
584
Abstract :
Mobile devices spend most of the time in standby mode. Supported features and functionalities are increasing in each newer model. With the wide spread adaptation of multi-tasking in mobile devices, retaining current status and data for all active tasks is critical for user satisfaction. Extending battery life in portable mobile devices necessitates the use of minimum possible energy in standby mode while retaining present states for all active tasks. This paper for the first time, explains the low-voltage data-retention failure mechanism in ops. It analyzes the impact of design and process parameters on the data-retention failure. Statistical nature of data retention failure is established and validated with extensive Monte-Carlo simulations across various process corners. Finally, silicon measurement from several 28nm industrial mobile chips is presented showing good correlation of retention failure prediction from simulation.
Keywords :
Monte Carlo methods; elemental semiconductors; flip-flops; low-power electronics; silicon; Monte-Carlo simulations; Si; battery life; low-voltage data-retention failure mechanism; low-voltage flop data retention; mobile chips; portable mobile devices; process technology; silicon correlation; size 28 nm; user satisfaction; CMOS integrated circuits; Correlation; Layout; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4673-4951-2
Type :
conf
DOI :
10.1109/ISQED.2013.6523669
Filename :
6523669
Link To Document :
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