• DocumentCode
    602963
  • Title

    A comparator energy model considering shallow trench isolation stress by geometric programming

  • Author

    Gong Chen ; Zhang Yu ; Bo Yang ; Qing Dong ; Nakatake, Shigetoshi

  • Author_Institution
    Sch. of Environ. Eng., Univ. of Kitakyushu, Kitakyushu, Japan
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    585
  • Lastpage
    590
  • Abstract
    In low power analog circuit designs, the current variation caused by the STI stress must be taken into account. In this paper, we address an energy trade-off related to the STI stress in the design of a comparator composed of the preamplifier and the conventional latch. The power consumption of the pre-amplifier can be formulated as a function of the diffusion length of MOSFETs when considering the STI stress. The longer diffusion length tends to make the power lower. On the other hand, the power to drive the latch is associated with the parasitic capacitance at the output of the pre-amplifier, so shorter diffusion is preferable. To cope with the trade-off, we provide the energy model of the comparator based on the geometric programming. In the post-layout HSPICE simulation with the STI BSIM model, we reveal that the impact of the STI stress on the energy becomes significant especially in low power designs.
  • Keywords
    MOSFET; comparators (circuits); geometric programming; isolation technology; power consumption; preamplifiers; MOSFET; STI BSIM model; STI stress; comparator; comparator energy model; diffusion; geometric programming; low power analog circuit design; post-layout HSPICE simulation; power consumption; preamplifier; shallow trench isolation stress; Latches; Logic gates; Noise measurement; Semiconductor device modeling; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523670
  • Filename
    6523670