• DocumentCode
    602983
  • Title

    Reliable Express-Virtual-Channel-based network-on-chip under the impact of technology scaling

  • Author

    Xin Fu ; Tao Li ; Fortes, Jose

  • Author_Institution
    EECS Dept., Univ. of Kansas, Lawrence, KS, USA
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    719
  • Lastpage
    726
  • Abstract
    Packet-switched on-chip interconnection networks are emerging as pervasive communication fabrics to connect different processing elements in multi/many-core chips. As a preferred NoC flow-control mechanism, Express Virtual Channel (EVC) allows packets to virtually bypass intermediate nodes to minimize communication delay. Technology scaling results in process variation and Negative Biased Temperature Instability (NBTI) which can significantly affect the reliability and lifetime of NoC fabricated using nano-meter transistors. In this paper, we propose a technique that significantly improves the reliability of EVC-based NoCs by reducing the simultaneous impact of process variation and NBTI. Our evaluation results using a detailed cycle-accurate simulator on a wide range of synthetic traffics and parallel benchmark traces show up to 75.5% guardband improvement over the conventional EVC-based NoCs.
  • Keywords
    delays; flow control; microprocessor chips; network-on-chip; EVC; NBTI; NoC flow-control mechanism; cycle-accurate simulator; express virtual channel; multi-many-core chips; nanometer transistors; packet-switched on-chip interconnection networks; parallel benchmark trace; pervasive communication fabrics; reliable express-virtual-channel-based network-on-chip; synthetic traffics; technology scaling impact; Degradation; Delays; Linear programming; Pipelines; Reliability engineering; Threshold voltage; Network-on-chip (NoC); express virtual channel (EVC); hardware reliability; negative biased temperature instability (NBTI); process variation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523690
  • Filename
    6523690