DocumentCode
602983
Title
Reliable Express-Virtual-Channel-based network-on-chip under the impact of technology scaling
Author
Xin Fu ; Tao Li ; Fortes, Jose
Author_Institution
EECS Dept., Univ. of Kansas, Lawrence, KS, USA
fYear
2013
fDate
4-6 March 2013
Firstpage
719
Lastpage
726
Abstract
Packet-switched on-chip interconnection networks are emerging as pervasive communication fabrics to connect different processing elements in multi/many-core chips. As a preferred NoC flow-control mechanism, Express Virtual Channel (EVC) allows packets to virtually bypass intermediate nodes to minimize communication delay. Technology scaling results in process variation and Negative Biased Temperature Instability (NBTI) which can significantly affect the reliability and lifetime of NoC fabricated using nano-meter transistors. In this paper, we propose a technique that significantly improves the reliability of EVC-based NoCs by reducing the simultaneous impact of process variation and NBTI. Our evaluation results using a detailed cycle-accurate simulator on a wide range of synthetic traffics and parallel benchmark traces show up to 75.5% guardband improvement over the conventional EVC-based NoCs.
Keywords
delays; flow control; microprocessor chips; network-on-chip; EVC; NBTI; NoC flow-control mechanism; cycle-accurate simulator; express virtual channel; multi-many-core chips; nanometer transistors; packet-switched on-chip interconnection networks; parallel benchmark trace; pervasive communication fabrics; reliable express-virtual-channel-based network-on-chip; synthetic traffics; technology scaling impact; Degradation; Delays; Linear programming; Pipelines; Reliability engineering; Threshold voltage; Network-on-chip (NoC); express virtual channel (EVC); hardware reliability; negative biased temperature instability (NBTI); process variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-4951-2
Type
conf
DOI
10.1109/ISQED.2013.6523690
Filename
6523690
Link To Document