DocumentCode :
60331
Title :
Coupling Analysis of Complex-Layout Traces Using a Circuit-Concept Approach
Author :
SangWook Park ; Kami, Yasushi ; YoonEui Nahm
Author_Institution :
Korea Automotive Technol. Inst., Cheonan, South Korea
Volume :
56
Issue :
1
fYear :
2014
fDate :
Feb. 2014
Firstpage :
208
Lastpage :
220
Abstract :
An analytical method is studied for estimating coupling between arbitrarily directed multiple finite-length lines with different line lengths and heights. Coupling or crosstalk analysis is performed by developing an expanded circuit-concept approach based on modified telegrapher´s equations of the Agrawal approach instead of the Taylor approach, providing some computational advantages. An electric image method using the quasi-static terms of the accurate Green´s function is used to estimate the electromagnetic fields in an inhomogeneous medium such as a printed circuit board. The approach is applied to the analysis of parallel and nonparallel or bent microstrip models, and embedded-line models in which one line is embedded and the other is on the surface layer. To verify the proposed approach, we conducted some experiments and compared the results of our approach with the results of measurements and a commercial electromagnetic solver.
Keywords :
Green´s function methods; crosstalk; electromagnetic fields; electromagnetic interference; microstrip lines; printed circuit layout; Agrawal method; Green function; arbitrarily directed multiple finite length lines; bent microstrip model; complex layout trace; coupling analysis; crosstalk analysis; electric image method; electromagnetic field; embedded line models; expanded circuit concept; nonparallel microstrip model; quasistatic terms; telegrapher equations; Couplings; Crosstalk; Equations; Mathematical model; Microstrip; Transmission line matrix methods; Transmission line theory; ABCD matrix; bent line; crosstalk; expanded circuit concept; modified telegrapher’s equations; multiconductor transmission lines (MTL) theory; multilayer; quasi-dynamic images method;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2013.2273078
Filename :
6570511
Link To Document :
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