DocumentCode :
603460
Title :
Fast Recovery Power Epitaxial Diode
Author :
Rojas-Hernandez, A.G. ; Vera-Marquina, A. ; Garcia-Juarez, A.
Author_Institution :
Dept. de Investig. en Fis., Univ. de Sonora, Hermosillo, Mexico
fYear :
2012
fDate :
19-23 Nov. 2012
Firstpage :
389
Lastpage :
394
Abstract :
Several diode designs to satisfy specific needs of quick response and power, this paper examines the arguments of a design that is economical in terms of manufacturing process but to improve the requirements of the few devices on the market with these characteristics (reverse breakdown voltage of 600V and reverse recovery time of 35ns). The design is tested using finite elements-through simulation and compared the results with commercial diodes by similar characteristics. The designed structure was p + nn +, with an epitaxial layer 50 mm thick and doped structure 2 × 1014 cm-3, which are obtained breakdown voltages of more than 600V and fast reverse recovery of less than 35 ns. A breakdown voltage of more than 600 V and reverse recovery times less than 35 ns were obtained for a p + nn + structure, with an epilayer of 50 μm thickness and doping of 2 to 3 × 1014 cm-3.
Keywords :
finite element analysis; power semiconductor diodes; semiconductor doping; diode designs; doped structure; epitaxial layer; fast recovery power epitaxial diode; fast reverse recovery; finite element simulation; manufacturing process; reverse breakdown voltage; reverse recovery time; size 50 mum; voltage 600 V; Semiconductors; physics semiconductor devices; power diodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Robotics and Automotive Mechanics Conference (CERMA), 2012 IEEE Ninth
Conference_Location :
Cuernavaca
Print_ISBN :
978-1-4673-5096-9
Type :
conf
DOI :
10.1109/CERMA.2012.69
Filename :
6524611
Link To Document :
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