Design and characteristics comparison of MicroCantilever for integrated sensing applications

Author

Jain, Vinesh ; Verma, Shalini

Author_Institution

Dept. of ELEX, SVKM´s NMIMS MPSTME, Mumbai, India

fYear

2013

fDate

23-25 Jan. 2013

Firstpage

1

Lastpage

4

Abstract

Emergence of Microelectromechanical Systems (MEMS) in the last decade has been tremendous and ever-growing. Microcantilever belong to MEMS class of devices and is truly the simplest structure. Merits for employing microcantilevers as sensing mechanism far outnumber the conventional senors. Sensing applications of Microcantilevers is widespread and explored. This work is dedicated to finite element (FE) 3D structural modeling of various micromechanical sensors. All cantilever design are made of silicon, poly and gold. ANSYS 13.0 gives 3D models which are close to reality mathematical models. It gives us stresses, strain and deflections for further analysis with a greater degree of accuracy. Micromechanical sensors made up of different materials have been explored. Characteristics improvement has been observed as a result of comparison.

Keywords

cantilevers; finite element analysis; microsensors; solid modelling; 3D models; ANSYS 13.0; FE 3D structural modeling; MEMS class; cantilever design; characteristics improvement; conventional senors; finite element 3D structural modeling; integrated sensing applications; mathematical models; microcantilever; microelectromechanical systems; sensing mechanism; Finite element analysis; Force; Sensors; Silicon; Strain; Stress; Cantilever; Piezoresistive and Elasticity;

fLanguage

English

Publisher

ieee

Conference_Titel

Advances in Technology and Engineering (ICATE), 2013 International Conference on

Conference_Location

Mumbai

Print_ISBN

978-1-4673-5618-3

Type

conf

DOI

10.1109/ICAdTE.2013.6524765

Filename

6524765