Title :
Considerations of high power electromagnetics (HPEM) transients with respect to Smart Grid
Author :
Radasky, William A. ; Koepke, Galen
Author_Institution :
Metatech Corp., Goleta, CA, USA
Abstract :
As part of the Smart Grid Interoperability Panel (SGIP) work, Electromagnetic Compatibility (EMC) was introduced as an integral process for the design of devices that will be used as part of the Smart Grid. This resulted in the formation of the Electromagnetic Interoperability Issues Working Group (EMII WG). This working group has produced a draft report that evaluates the electromagnetic environment for new electronic devices to be introduced into the Smart Grid of the future. This evaluation is needed to determine if existing EMC immunity standards are available now or whether new standards need to be developed.
Keywords :
electromagnetic compatibility; smart power grids; EMC; EMII WG; HPEM Transient; SGIP; electromagnetic compatibility; electromagnetic environment; electromagnetic interoperability issues working group; electronic devices; high power electromagnetic transient; smart grid interoperability panel; Electromagnetic compatibility; Interoperability; Smart grids; Standards; Storms; Transient analysis;
Conference_Titel :
Radio Science Meeting (USNC-URSI NRSM), 2013 US National Committee of URSI National
Conference_Location :
Boulder, CO
Print_ISBN :
978-1-4673-4776-1
DOI :
10.1109/USNC-URSI-NRSM.2013.6525041
