Study of effects of high-k dielectrics in Schottky Tunneling Source MOSFETs

Author

Ajayan, J. ; Subash, T.D. ; Gnanasekaran, T. ; Kumar, N.M.

Author_Institution

Dept. of ECE, IJCET, Tirunelveli, India

fYear

2013

fDate

22-23 March 2013

Firstpage

475

Lastpage

479

Abstract

The Asymmetric Schottky Tunneling Source SOI-MOSFET (STSFET) is a promising device alternative for future nanometer-scale technology. The device has been modeled and simulated using TCAD SYNOPSYS tool. This paper presents a detailed study of device structure, design and characteristics of both p-type and n-type Asymmetric Schottky Tunneling Source SOI-MOSFETs. The important parameters of the device are schottky barrier height and gate oxide thickness. With the metallic (silicide) source / drain regions, schottky barriers are formed at the source/silicon and drain/silicon junctions. The schottky barrier height can be controlled by applying voltage at the gate. The optimized device shows excellent short channel immunity compared to conventional MOSFETs which helps to improve the scalability and output resistance of the device. The asymmetric nature of the device helps to improve the linear characteristics of the device.

Keywords

MOSFET; Schottky barriers; dielectric materials; elemental semiconductors; silicon; silicon-on-insulator; technology CAD (electronics); tunnelling; Schottky barrier height; Si; TCAD SYNOPSYS tool. simulation; asymmetric schottky tunneling source SOI-MOSFET; drain region; drain-silicon junction; gate oxide thickness; high-k dielectrics effect; metallic source; n-type STSFET; nanometer-scale technology; p-type STSFET; scalability; short channel immunity; source-silicon junction; voltage control; Logic gates; MOSFET; Metals; Schottky barriers; Silicides; Silicon; Tunneling; Design Optimization; High-k dielectric materials; Schottky gate field effect transistors; Semiconductor-metal interface; Silicon on insulator technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Automation, Computing, Communication, Control and Compressed Sensing (iMac4s), 2013 International Multi-Conference on

Conference_Location

Kottayam

Print_ISBN

978-1-4673-5089-1

Type

conf

DOI

10.1109/iMac4s.2013.6526458

Filename

6526458