DocumentCode
604743
Title
The Impact of Process-Induced Mechanical Stress in Narrow Width Devices and Circuit Design Issues
Author
Alam, Naushad ; Anand, B. ; Dasgupta, S.
Author_Institution
Electron. & Comput. Eng. Dept., Indian Inst. of Technol. Roorkee, Roorkee, India
fYear
2012
fDate
19-22 Dec. 2012
Firstpage
213
Lastpage
215
Abstract
In this work we present a simulation based study of the impact of process-induced mechanical stress in narrow width devices and its implication on circuit design. We observe that the channel stress and hence drive current of narrow width devices significantly depend upon the actual width of a device. We present a model for estimating width dependent channel stress and effective drive current in strain engineered devices. Width dependent change in drive strength causes WP/WN ratio (also referred to as ´ß´) in inverters to change with inverter scaling factor ´S´. If not accounted for, this results into a suboptimal circuit design. Finally with the help of CMOS tapered buffer design examples we show that assigning ß individually to each stage while considering the narrow width effects (NWE) results into simultaneous improvement in delay, power and silicon area.
Keywords
CMOS integrated circuits; buffer circuits; stress analysis; CMOS tapered buffer design; NWE; channel stress; circuit design; narrow width effects; process-induced mechanical stress; suboptimal circuit design; width dependent channel stress estimation; CMOS buffers; INWE; STI; TCAD; eSiC; eSiGe; mechanical stress; t/c-ESL;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System Design (ISED), 2012 International Symposium on
Conference_Location
Kolkata
Print_ISBN
978-1-4673-4704-4
Type
conf
DOI
10.1109/ISED.2012.42
Filename
6526586
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