• DocumentCode
    604743
  • Title

    The Impact of Process-Induced Mechanical Stress in Narrow Width Devices and Circuit Design Issues

  • Author

    Alam, Naushad ; Anand, B. ; Dasgupta, S.

  • Author_Institution
    Electron. & Comput. Eng. Dept., Indian Inst. of Technol. Roorkee, Roorkee, India
  • fYear
    2012
  • fDate
    19-22 Dec. 2012
  • Firstpage
    213
  • Lastpage
    215
  • Abstract
    In this work we present a simulation based study of the impact of process-induced mechanical stress in narrow width devices and its implication on circuit design. We observe that the channel stress and hence drive current of narrow width devices significantly depend upon the actual width of a device. We present a model for estimating width dependent channel stress and effective drive current in strain engineered devices. Width dependent change in drive strength causes WP/WN ratio (also referred to as ´ß´) in inverters to change with inverter scaling factor ´S´. If not accounted for, this results into a suboptimal circuit design. Finally with the help of CMOS tapered buffer design examples we show that assigning ß individually to each stage while considering the narrow width effects (NWE) results into simultaneous improvement in delay, power and silicon area.
  • Keywords
    CMOS integrated circuits; buffer circuits; stress analysis; CMOS tapered buffer design; NWE; channel stress; circuit design; narrow width effects; process-induced mechanical stress; suboptimal circuit design; width dependent channel stress estimation; CMOS buffers; INWE; STI; TCAD; eSiC; eSiGe; mechanical stress; t/c-ESL;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System Design (ISED), 2012 International Symposium on
  • Conference_Location
    Kolkata
  • Print_ISBN
    978-1-4673-4704-4
  • Type

    conf

  • DOI
    10.1109/ISED.2012.42
  • Filename
    6526586