Enclosed liquid natural convection as a means of transferring heat from microelectronics to cold plates

Liquid immersion of datacom electronics can be configured as a cooling mechanism when components are in direct contact with a high dielectric strength liquid. This paper analyses the heat transfer capabilities of datacom electronics when they are enclosed in a cassette with a dielectric liquid and sandwiched against a cold plate positioned in parallel with the printed circuit board. A proxy server motherboard with controllable heat cells and temperature sensors is used to conduct a series of heat transfer experiments. The results of which demonstrate that the thermal conductance processes via the naturally convecting dielectric liquid improves as the power demand of the electronics increases.