Transient thermal characterization of a fcBGA-H device

In this paper, we describe a study in which the thermal performance data of Theta jc (Rth-JC), Theta ja (Rth-JA), and structure functions of a flip-chip ball grid array device with heat spreader, fcBGA-H, was measured. For Rth-JC, various boundary conditions for the thermal resistance modeling were considered and are discussed here. A transient measurement method was used to obtain the temperature responses of the diodes. The structure functions of the diodes were measured; and the thermal resistances were calculated. Furthermore, the effect of power map on the structure functions was studied, and a thermal simulation was conducted to match the simulated structure functions with the experimental structure functions. The matched simulation structure functions provides the most accurate thermal resistor network for system level thermal evaluation.