DocumentCode :
604851
Title :
Analysis and testing of a thermoelectric heat exchanger configured for cooling a processor module heat load
Author :
Campbell, L. ; Wright, L.
Author_Institution :
IBM, Poughkeepsie, NY, USA
fYear :
2013
fDate :
17-21 March 2013
Firstpage :
93
Lastpage :
98
Abstract :
The testing and subsequent data analysis of a liquid to liquid thermoelectric heat exchanger configured to provide cooled water to a heat load are discussed in the following paper. In the test apparatus, water flow rates and temperatures are recorded. From previously obtained heat transfer data for each heat exchanger plate, and from previous thermoelectric heat exchanger analysis work by Campbell et al. [1] and Luo [2], a model is developed and fit to the current data. Various scenarios are then developed to explore the performance of the thermoelectric heat exchanger in multiple operating modes.
Keywords :
data analysis; heat exchangers; thermoelectric cooling; cooling; data analysis; liquid to liquid thermoelectric heat exchanger; multiple operating modes; processor module heat load; water flow rates; Cold plates; Equations; Heat pumps; Mathematical model; Water heating; Thermoelectric; heat exchanger;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2013.6526811
Filename :
6526811
Link To Document :
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