Title :
Double-sided tin nanowire arrays for advanced thermal interface materials
Author :
Bo Feng ; Faruque, F. ; Peng Bao ; An-Ting Chien ; Kumar, Sudhakar ; Peterson, G.P.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This investigation examines a fundamentally new type of thermal interface material (TIM) based on a double-sided array of tin nanowires (NWs) prepared using a hot-pressing approach with the assistance of anodic aluminum oxide templates. The metal based TIM effectively reduces the contact resistance, while the flexible nanowires show excellent mechanical compliance to increase the actual contact area with the mating rough surfaces. The results indicate that the overall thermal contact resistance of the two rough copper surfaces assisted by the tin NW array can reduce the overall resistance to 29 mm2KW-1 at 0.25 MPa and 20 mm2KW-1 at 1.0 MPa.
Keywords :
contact resistance; elemental semiconductors; flexible electronics; hot pressing; materials preparation; nanowires; rough surfaces; thermal resistance; tin; NW; Sn; TIM; advanced thermal interface material; anodic aluminum oxide template; double-sided tin nanowire array; flexible nanowire; hot-pressing approach; mating rough copper surface; pressure 0.25 MPa; pressure 1.0 MPa; thermal contact resistance; Materials; Rough surfaces; Surface resistance; Surface roughness; Thermal conductivity; Thermal resistance; Tin; Heat conduction; Thermal interface material; Thermal resistance; nanowire array;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
DOI :
10.1109/SEMI-THERM.2013.6526813
