Double-sided tin nanowire arrays for advanced thermal interface materials

Author

Bo Feng ; Faruque, F. ; Peng Bao ; An-Ting Chien ; Kumar, Sudhakar ; Peterson, G.P.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2013

fDate

17-21 March 2013

Firstpage

105

Lastpage

109

Abstract

This investigation examines a fundamentally new type of thermal interface material (TIM) based on a double-sided array of tin nanowires (NWs) prepared using a hot-pressing approach with the assistance of anodic aluminum oxide templates. The metal based TIM effectively reduces the contact resistance, while the flexible nanowires show excellent mechanical compliance to increase the actual contact area with the mating rough surfaces. The results indicate that the overall thermal contact resistance of the two rough copper surfaces assisted by the tin NW array can reduce the overall resistance to 29 mm²KW^-1 at 0.25 MPa and 20 mm²KW^-1 at 1.0 MPa.

Keywords

contact resistance; elemental semiconductors; flexible electronics; hot pressing; materials preparation; nanowires; rough surfaces; thermal resistance; tin; NW; Sn; TIM; advanced thermal interface material; anodic aluminum oxide template; double-sided tin nanowire array; flexible nanowire; hot-pressing approach; mating rough copper surface; pressure 0.25 MPa; pressure 1.0 MPa; thermal contact resistance; Materials; Rough surfaces; Surface resistance; Surface roughness; Thermal conductivity; Thermal resistance; Tin; Heat conduction; Thermal interface material; Thermal resistance; nanowire array;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4673-6427-0

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/SEMI-THERM.2013.6526813

Filename

6526813