DocumentCode :
604867
Title :
Preliminary first principle based electro-thermal coupled solver for silicon carbide power devices
Author :
Fan, Angie ; Troszak, G. ; Desai, T. ; Palacios, T. ; Kaviany, M. ; Seungha Shin
Author_Institution :
Adv. Cooling Technol., Inc., Lancaster, PA, USA
fYear :
2013
fDate :
17-21 March 2013
Firstpage :
189
Lastpage :
193
Abstract :
The electrical behavior of high power, high frequency power devices is dramatically affected by heat generation caused due to interactions between energetic electrons and the lattice. It is critical that these interactions are taken into account when attempting to predict the electrical behavior of these devices. Since the hydrodynamic model follows the mass, momentum and energy transfer between the electrons/holes and phonons, it is capable of simultaneously predicting the electrical and thermal performance of these devices. This model is accurate and computationally efficient when properly correlated material parameters are available. In this work, a preliminary hydrodynamic transport device solver capable of accurately predicting the thermal and electrical performance of SiC devices is presented.
Keywords :
hydrodynamics; power semiconductor devices; semiconductor device models; silicon compounds; wide band gap semiconductors; SiC; electrical behavior; electrical performance; electro-thermal coupled solver; energetic electrons; energy transfer; heat generation; high power high frequency power devices; hydrodynamic model; hydrodynamic transport device solver; material parameters; thermal performance; Acoustics; Charge carrier processes; Hydrodynamics; Logic gates; Mathematical model; Phonons; Silicon carbide; SiC power switching devices; hydrodynamic approach; transient temperature solver;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2013.6526827
Filename :
6526827
Link To Document :
بازگشت