• DocumentCode
    604871
  • Title

    Utilizing practical fan curves in CFD modeling of a data center

  • Author

    Alkharabsheh, S. ; Sammakia, B. ; Shrivastava, S. ; Schmidt, R.

  • Author_Institution
    State Univ. of New York at Binghamton, Binghamton, NY, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    211
  • Lastpage
    215
  • Abstract
    In this paper we utilize a previous experimentally-verified numerical approach to simulate fan curves in the CRAC units and the servers in a representative data center. Computational fluid dynamics is used to model the data center and implementing the manufacturer fan curves on the devices. The turbulent flow is modeled by adopting k-ε model and the Boussinesq approximation is used to model the buoyancy effect. We investigate the sources of pressure drops and calibrate the CRAC units and the servers using fan curves obtained from the manufacturer and can be practically used for the modular data center. This approach was verified in previous study by comparing the airflow through the perforated plates with experimental measurements in a smaller testing room. A comparative study is established to compare between the fixed flow approximations with variable flow based on fan curves. The results show the validity of this approach by obtaining a good agreement with fixed flow for an uncontained data center.
  • Keywords
    aerodynamics; building management systems; computational fluid dynamics; computer centres; fans; turbulence; Boussinesq approximation; CFD modeling; CRAC units; airflow; buoyancy effect; experimentally-verified numerical approach; fan curves; fixed flow approximations; k-ε model; manufacturer fan curves; modular data center; testing room; uncontained data center; variable flow; Atmospheric modeling; Calibration; Computational fluid dynamics; Computational modeling; Data models; Numerical models; Servers; Data center; calibration; fan curves; pressure drops;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526831
  • Filename
    6526831