Title :
Utilizing practical fan curves in CFD modeling of a data center
Author :
Alkharabsheh, S. ; Sammakia, B. ; Shrivastava, S. ; Schmidt, R.
Author_Institution :
State Univ. of New York at Binghamton, Binghamton, NY, USA
Abstract :
In this paper we utilize a previous experimentally-verified numerical approach to simulate fan curves in the CRAC units and the servers in a representative data center. Computational fluid dynamics is used to model the data center and implementing the manufacturer fan curves on the devices. The turbulent flow is modeled by adopting k-ε model and the Boussinesq approximation is used to model the buoyancy effect. We investigate the sources of pressure drops and calibrate the CRAC units and the servers using fan curves obtained from the manufacturer and can be practically used for the modular data center. This approach was verified in previous study by comparing the airflow through the perforated plates with experimental measurements in a smaller testing room. A comparative study is established to compare between the fixed flow approximations with variable flow based on fan curves. The results show the validity of this approach by obtaining a good agreement with fixed flow for an uncontained data center.
Keywords :
aerodynamics; building management systems; computational fluid dynamics; computer centres; fans; turbulence; Boussinesq approximation; CFD modeling; CRAC units; airflow; buoyancy effect; experimentally-verified numerical approach; fan curves; fixed flow approximations; k-ε model; manufacturer fan curves; modular data center; testing room; uncontained data center; variable flow; Atmospheric modeling; Calibration; Computational fluid dynamics; Computational modeling; Data models; Numerical models; Servers; Data center; calibration; fan curves; pressure drops;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
DOI :
10.1109/SEMI-THERM.2013.6526831