• DocumentCode
    604872
  • Title

    Reduced-order modeling framework for improving spatial resolution of data center transient air temperatures

  • Author

    Ghosh, Rajesh ; Joshi, Yash ; Klein, Liviu ; Hamann, Hendrik F.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    216
  • Lastpage
    222
  • Abstract
    A proper orthogonal decomposition (POD)-based modeling framework is developed for improving the spatial resolution of transient rack air temperature data collected in a heterogeneous data center (DC) facility. Blocking cooling air inflow into racks periodically, three sets of transient temperature data are collected at the outlets of electronic equipment residing in three different racks. Using various combinations of initial discrete data as ensembles, the capability of the proposed POD/ interpolation framework for predicting new temperature data is demonstrated. The accuracy of POD-based temperature predictions is validated by comparing it to corresponding experimental data. The root mean square deviations between experimental data and POD-based predictions are found to be on the order of 5%.
  • Keywords
    building management systems; computer centres; cooling; interpolation; reduced order systems; transient analysis; DC facility; POD-based predictions; POD-based temperature predictions; blocking cooling air inflow; data center transient air temperatures; electronic equipment; heterogeneous data center facility; initial discrete data as ensembles; interpolation framework; orthogonal decomposition-based modeling framework; racks; reduced-order modeling framework; root mean square deviations; spatial resolution; transient rack air temperature data; transient temperature data; Atmospheric modeling; Spatial resolution; Temperature distribution; Temperature measurement; Temperature sensors; Transient analysis; Data center; dynamic events; proper orthogonal decomposition; transient temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526832
  • Filename
    6526832