DocumentCode
604872
Title
Reduced-order modeling framework for improving spatial resolution of data center transient air temperatures
Author
Ghosh, Rajesh ; Joshi, Yash ; Klein, Liviu ; Hamann, Hendrik F.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2013
fDate
17-21 March 2013
Firstpage
216
Lastpage
222
Abstract
A proper orthogonal decomposition (POD)-based modeling framework is developed for improving the spatial resolution of transient rack air temperature data collected in a heterogeneous data center (DC) facility. Blocking cooling air inflow into racks periodically, three sets of transient temperature data are collected at the outlets of electronic equipment residing in three different racks. Using various combinations of initial discrete data as ensembles, the capability of the proposed POD/ interpolation framework for predicting new temperature data is demonstrated. The accuracy of POD-based temperature predictions is validated by comparing it to corresponding experimental data. The root mean square deviations between experimental data and POD-based predictions are found to be on the order of 5%.
Keywords
building management systems; computer centres; cooling; interpolation; reduced order systems; transient analysis; DC facility; POD-based predictions; POD-based temperature predictions; blocking cooling air inflow; data center transient air temperatures; electronic equipment; heterogeneous data center facility; initial discrete data as ensembles; interpolation framework; orthogonal decomposition-based modeling framework; racks; reduced-order modeling framework; root mean square deviations; spatial resolution; transient rack air temperature data; transient temperature data; Atmospheric modeling; Spatial resolution; Temperature distribution; Temperature measurement; Temperature sensors; Transient analysis; Data center; dynamic events; proper orthogonal decomposition; transient temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-6427-0
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/SEMI-THERM.2013.6526832
Filename
6526832
Link To Document